Interface device and information processing system
AssigneeHitachi, Ltd.
InventorsFumio Murabayashi, Takashi Sase, Mutsumi Kikuchi, Atsuo Watanabe, Masatsugu Amishiro, Kenji Tabuchi
Life of this patent
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Abstract
A first converter circuit converts a state signal, whose level is constant or slowly varies during a predetermine period of time, into a pulse signal to allow the signal to propagate across an electrically insulating area. A second converter circuit converts the pulse signal, which has propagated through an insulating circuit, into the original state signal or a signal having the same characteristics as the original state signal.
Claims22
An interface device comprising a first area formed of a plurality of circuits, a second area formed of a plurality of circuits and an insulating circuit for coupling said first area and said second area through a capacitor;
- wherein said first area includes a first converter circuit which converts a state signal into a pulse signal, and said second area includes a second converter circuit which converts a pulse signal output from said first converter circuit and transmitted through said insulating circuit, into a new state signal.
An information processing system comprising:
- an input unit which inputs information;
- a processing unit which processes the information input from said input unit or the information sent from an external source;
- and
- a display unit which displays the result of the processing in said processing unit;
- wherein said processing unit includes a receiving section which receives the information input from an external source, a processing section which processes the information sent from said receiving section, and an insulating circuit which couples said receiving section and said processing section to each other through a capacitor, wherein said receiving section includes a first converter circuit which converts a state signal into a pulse signal, and wherein said processing section includes a second converter circuit which converts the pulse signal output from said first converter circuit and transmitted through said insulating circuit, into a new state signal.
An information processing system comprising:
- a plurality of signal lines for transmitting signals;
- at least a first information processing unit which processes the information based on the signal transmitted through said signal lines;
- and
- an interface device connected between a plurality of said signal lines and said information processing unit;
- wherein said interface device includes;
- a first area formed of a receiver circuit which receives a signal transmitted thereto through a plurality of said signal lines, a power supply circuit which generates a voltage supplied to said receiver circuit, and a first converter circuit which converts the voltage output from said power supply circuit into a pulse signal,
- a second area formed of a signal processing circuit which processes the signal received by said receiver circuit, and a second converter circuit which converts said pulse signal converted by said first signal converter circuit, into a state signal, and
- an insulating circuit which couples said first area and said second area to each other through a capacitor.
A semiconductor integrated circuit device with a network transceiver and at least one power supply circuit formed on the same semiconductor substrate, wherein at least one of said power supply circuits is a switching regulator.
A semiconductor integrated circuit device with a network transceiver and at least two power supply circuits formed on the same semiconductor substrate, wherein at least one of said power supply circuits is a switching regulator, and at least one of said power supply circuits is a dropper-type regulator.
A semiconductor integrated circuit device including a semiconductor integrated circuit 1 with a network transceiver 1 and at least one power supply circuit 1 formed on the same semiconductor substrate, wherein the output of the input/output terminal of the transceiver 1 and the output terminal of the power supply circuit 1 are connected to a pin of the package having the semiconductor circuit 1 mounted thereon.
A semiconductor integrated circuit device having a SOI (silicon on insulator) structure comprising a support base, a semiconductor base, an active layer which forms elements, an oxide film interposed between the active layer and the support base, and insulating grooves formed on the semiconductor base, the element forming area 1 and the element forming area 2 being electrically insulated from each other by the insulating grooves located therebetween, wherein the support base and the active layer base 1 are electrically connected to each other.
Dependencies are inferred from the claim text.