Wafer external inspection apparatus
AssigneeNEC Electronics Corporation
InventorToyokazu Nakamura
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Abstract
There is disclosed a wafer external inspection apparatus of a dark field reflective type for irradiating an external defect on a surface of a die on a semiconductor device wafer with incoherent illumination to detect the external defect from an image captured by a one-dimensional camera, the apparatus comprising illumination means in which an azimuth angle of at least one incoherent illumination becomes a 45-degree group azimuth of about 45 degrees, about 135 degrees, about 225 degrees or about 315 degrees within the surface of the wafer with respect to an azimuth of patterns occupying a majority in the die.
Claims6
A wafer external inspection apparatus of a dark field reflective type for irradiating an external defect on a surface of a die on a semiconductor device wafer with incoherent illumination to detect the external defect from an image captured by a one-dimensional camera, the apparatus comprising illumination means in which an azimuth angle of at least one incoherent illumination becomes a 45-degree group azimuth of about 45 degrees, about 135 degrees, about 225 degrees or about 315 degrees within the surface of the wafer with respect to an azimuth of patterns occupying a majority in the die.
Dependencies are inferred from the claim text.