Method of laser machining a fluid slot
AssigneeHewlett-Packard Development Company, L.P.
InventorsDavid Cahill, Jeffrey R. Pollard, Declan John O'Reilly, Graeme Scott, Noel McLoughlin
Life of this patent
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Abstract
A method of laser machining a fluid slot includes directing a UV laser beam towards a substrate with microelectronics to form a slot through the substrate.
Claims28
A method of laser machining a fluid channel comprising:
- directing a UV laser beam towards a substrate with microelectronics to form a fluid channel through the substrate,
- wherein the substrate has a first surface with a first channel area and an opposite second surface with a second channel area, wherein the laser beam is directed towards the first and second channel areas for bi-directional laser machining of the fluid channel.
A method of laser machining a fluid slot comprising directing a diode-pumped solid-state pulsed UV laser beam towards a substrate with microelectronics to form a fluid slot through the substrate.
A method of laser machining a fluid channel comprising:
- forming a fluid channel in a substrate with microelectronics, wherein the substrate has a first surface, a second opposite surface, and at least two channel areas on each of the first and second surfaces, wherein the at least two channel areas of the first surface correspond to the at least two channel areas of the second surface,
- laser-machining the at least two channel areas on the first surface simultaneously with a diode-pumped solid-state pulsed UV laser beam;
- and
- laser-machining the at least two channel areas on the second surface simultaneously.
A method of laser machining a fluid feature comprising:
- directing a diode-pumped solid-state pulsed UV laser beam towards a substrate surface to form at least two of a fluid slot, a trench, a series of fluid holes, and an edge step in the substrate.
A method of laser machining a fluid channel comprising:
- forming a fluid channel in a substrate with microelectronics, wherein the substrate has a first surface with a first area, and a second opposite surface;
- laser-machining the first surface in the vicinity of the first area with a diode-pumped solid-state pulsed UV laser beam having a wavelength of about 350 nm to 355 nm.
A method of manufacturing a printhead comprising:
- UV laser-machining a substrate having a fluid ejector to form a fluid slot with a diode-pumped solid-state pulsed UV laser beam.
A method of manufacturing a fluid slot for a printing component comprising:
- varying a laser-machining process to create a particular slot wall surface, wherein varying the process includes at least one of varying a UV laser beam diameter with a beam expander, moving a UV laser beam focal point relative to a substrate surface subjected to laser-machining, and adjusting settings on a UV laser machine tool, wherein the UV laser beam is a diode-pumped solid-state pulsed UV laser beam.
A component having a fluid slot formed using a UV laser-machining process comprising:
- a fluid ejector upon a first surface of at least one a silicon substrate and a ceramic substrate;
- a fluid slot through the substrate formed using a UV laser beam, wherein fluid is capable of flowing through the fluid slot in the substrate to the fluid ejector.
A method of laser machining a fluid channel comprising:
- directing a UV laser beam towards a substrate to form a fluid channel through the substrate,
- wherein the substrate has a first surface with a first channel area and an opposite second surface with a second channel area,
- wherein the first surface has active layers,
- wherein the laser beam is directed towards the first and second channel areas for bi-directional laser machining of the fluid channel,
- wherein the bi-directional machining limits contamination to the active layers.
Dependencies are inferred from the claim text.