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US 2003/0117129 A1Published application
Low-cost tester interface module
AssigneeTeradyne, Inc.
InventorFrank Parrish
Life of this patent
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AssigneeTeradyne, Inc.
InventorFrank Parrish
Estimating the term…
An interface module for connecting a plurality of signal paths from a first electronic assembly to a second electronic assembly is disclosed. The interface module includes a plurality of coaxial cables having distal ends adapted for coupling to the first electronic assembly and proximal ends, each cable having a shield conductor and a center conductor. A stiffener formed with a plurality of throughbores receives the proximal ends of the plurality of signal cables, the stiffener having a flat termination side at one end of the plurality of throughbores. The module further includes a signal transition assembly having a flat substrate bonded to the stiffener termination side. The substrate includes respective opposite sides and is formed with spaced-apart signal paths and ground paths extending from one side to the other side. Each center conductor and shield conductor are electrically coupled to the signal paths and ground paths and mounted to the signal transition assembly to minimize relative axial displacement.
An interface module for connecting a plurality of signal paths from a first electronic assembly to a second electronic assembly, the interface module including:
An ATE interface for coupling high-frequency tester channels to a device-under-test, the interface including:
Dependencies are inferred from the claim text.