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US 2003/0116868 A1Published application
Method and apparatus for encoding information in an ic package
AssigneeIntel Corporation
InventorsJOHN W. HORIGAN, LARRY L. MORESCO
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) package includes a substrate, a ground line, and an encoded region. The encoded region provides information based upon selective deposition of solder balls electrically coupled to the ground line.
Claims18
An integrated circuit (IC) package comprising:
- a substrate including an IC;
- a ground line;
- and
- an encoded region to provide information based upon selective deposition of solder balls electrically coupled to the ground line.
1 more element
An electronic component comprising:
- a ball grid array (BGA) package including an encoded region to provide information based upon selective deposition of solder balls;
- and
- a printed circuit board (PCB) coupled to the package.
A method of encoding information in an integrated circuit (IC) package, the method comprising:
- depositing a first solder ball in a first solder ball area of an encoded region of an IC package to denote a first logical level;
- and
- preventing a solder ball from being deposited in a second solder ball area of the encoded region of the IC package to denote a second logical level.
Dependencies are inferred from the claim text.