Underfill process for flip-chip device
AssigneeIntel Corporation
InventorsSong-Hua Shi, Milan Djukic
Life of this patent
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Abstract
The present invention relates to a method of packaging a microelectronic device that, in one embodiment, uses a vacuum-assisted underfill process. One embodiment of the method uses a curing process with a tacky film disposed over the device to prevent wicking of the underfill material after the underfill material is in place. One embodiment of the method uses a curing process that utilizes a non-tacky tacky film with a curing process to prevent wicking of the underfill material after the underfill material is in place.
Claims26
A method of forming a package, comprising:
- placing a film against a flip-chip assembly, wherein the flip-chip assembly includes a die, an electrical connection, and a mounting substrate;
- underfilling the die with underfill material;
- curing the underfill material;
- and
- after beginning curing the underfill material, removing the film.
A method of forming a package, comprising:
- stretching a flexible film over die that is mounted on a mounting substrate to seal the flexible film thereupon;
- flowing underfill material between the die and the mounting substrate with a source and a vent;
- heating the underfill material to a first curing temperature;
- and
- after reaching the first curing temperature, removing the flexible film.
A chip package comprising:
- a die;
- a mounting substrate;
- an electrical connection disposed between the mounting substrate and the die;
- a cured underfill material including a fillet portion, and an interstitial portion disposed between the die and the mounting substrate, wherein the fillet portion includes a surface roughness and pattern that is characteristic of an interstitial film surface roughness and pattern.
A chip-packaging process system comprising:
- a die;
- a mounting substrate;
- an electrical connection disposed between the mounting substrate and the die;
- a tacky film that is disposed over the die and stretched onto the mounting substrate;
- a mold press that gives a shape to the film;
- an underfill material disposed between the die and the mounting substrate;
- and
- an underfill inlet and outlet system that communicates through the film.
Dependencies are inferred from the claim text.