Semiconductor chip-mounting board
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHiroyuki Otani, Yoshihiko Yagi, Kenichi Yamamoto
Life of this patent
Estimating the term…
Abstract
A strengthening land is formed on a semiconductor chip-mounting board correspondingly to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improve a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.
Claims5
A semiconductor chip-mounting board comprising a semiconductor chip-mounting face where bonding lands are formed and are electrically connected in a flip chip-mounting method to electrodes formed at a circuit formation face of a semiconductor chip, and a circuit board-mounting face, opposed to the semiconductor chip-mounting face, which allows an electrical connection to be established between the semiconductor chip-mounting board and a circuit board;
- wherein a strengthening land is further provided at the semiconductor chip-mounting face, the strengthening land being connected via a bonding material to a non-operating electrode formed on the circuit formation face and functionally not related to the semiconductor chip, thereby to increase a connection strength between the semiconductor chip and the semiconductor chip-mounting board;
- and
- wherein the strengthening land formed on the semiconductor chip-mounting face is strip-shaped extending radially to the mounted semiconductor chip in a length preventing the bonding material from spreading beyond a width thereof over the semiconductor chip-mounting face, and in a direction from a contact point thereof to a bump on the electrode to a central part of the semiconductor chip, and an inner end of the strengthening land extends toward the central part of the semiconductor chip beyond an inner end of a bump connecting the strengthening land to the non-operating electrode.
A semiconductor chip-mounting board comprising a semiconductor chip-mounting face where bonding lands are formed and are electrically connected in a flip chip-mounting method to electrodes formed at a circuit formation face of a semiconductor chip;
- wherein a strengthening land is provided at the semiconductor chip-mounting face, the strengthening land being connected via a bonding material to a non-operating electrode formed on the circuit formation face and functionally not related to the semiconductor chip, thereby to increase a connection strength between the semiconductor chip and the semiconductor chip-mounting board;
- and
- wherein the strengthening land formed on the semiconductor chip-mounting face is strip-shaped extending radially to the mounted semiconductor chip in a length preventing the bonding material from spreading beyond a width thereof over the semiconductor chip-mounting face, and in a direction from a contact point thereof to a bump on the electrode to a central part of the semiconductor chip, and an inner end of the strengthening land extends toward the central part of the semiconductor chip beyond an inner end of a bump connecting the strengthening land to the non-operating electrode.
Dependencies are inferred from the claim text.