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US 2003/0116862 A1Published application
Glueless integrated circuit system in packaging module
AssigneeChipMOS Technologies Inc.
InventorsKuo-Ning Chiang, Wen-Hwa Chen, Kuo-Tai Tseng
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Abstract
An integrated circuit chip with ball-grid array solder balls is packaged as a module without being sealed in protective glue. The IC chip is mounted on an insulating substrate with pads to support the solder balls. The pads are conducted to a second set of pads along the periphery of the substrate. Leads are pressed against the second set of pads for external connections. A second IC chip may be pressed against the other side of the substrate to increase the external connections.
Claims4
A glueless integrated circuit (IC) module, comprising:
- an IC chip with ball-grid array solder contacts;
- an insulating substrate;
- a first set of pads on top of said substrate to mate with said solder contacts;
- a second set of pads along the edge of said substrate wired to said first set of pads;
- a first set of leads mating with said second set of pads and extending outside said module for external connection, and pressed against said second set of pads by pressing said IC chip to make electrical contacts;
- and
- on the bottom side of said substrate, a second IC chip with second set of ball-grid array, a third set pads which mate with solder balls of the second set of ball-grid array, and a fourth set of pads along the edge of said substrate wired to said third set of pads.
4 more elements
Dependencies are inferred from the claim text.