Circuit substrate and method for fabricating the same
AssigneeFujitsu Limited
InventorsOsamu Taniguchi, Yasuo Yamagishi, Koji Omote
Life of this patent
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Abstract
The circuit substrate comprises a silicon substrate 10 with through-holes 12 formed in, conducting films 18a, 18a, 18c formed on the inside walls of the through-holes 12, and an organic resin film 20 formed on the surface of at least one side of the silicon substrate and covering at least parts of the through-holes 12. Accordingly, even in a case where the through-holes formed, micronized at a small pitch, the substrate does not lower the mechanical strength. Thus, the circuit substrate which is applicable to high-density packaging can be provided.
Claims20
A circuit substrate comprising:
- a substrate with a through-hole formed in;
- a conducting film formed on the inside wall of the through-hole and exposed in the cavity inside the through-hole;
- and
- a reinforcing film of an organic resin formed on the surface of at least one side of the substrate and covering at least a part of the opening of the through-hole.
A method for fabricating a circuit substrate comprising the steps of:
- forming a through-hole in a substrate;
- forming a conducting film on the inside wall of the through-hole, exposed in the cavity inside the through-hole;
- and
- forming a reinforcing film of an organic resin on the surface of at least one side of the substrate, covering the opening of the through-hole.
Dependencies are inferred from the claim text.