Micro-scale interconnect device with internal heat spreader and method for fabricating same
AssigneeCoventor, Inc.
InventorsSubham Sett, Shawn Jay Cunningham
Life of this patent
Estimating the term…
Loading patent…
AssigneeCoventor, Inc.
InventorsSubham Sett, Shawn Jay Cunningham
Estimating the term…
A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communication lines to be transferred away from the communication lines.
A micro-scale interconnect device for transmitting electrical current or discrete signals, comprising:
A micro-scale interconnect device for transmitting electrical current or discrete signals, comprising:
A micro-scale system comprising:
A method for fabricating a micro-scale device having internal heat spreading capability to reduce operating temperature, comprising the steps of forming a plurality of generally coplanar arrays of electrical transmission lines in a heterostructure, and embedding a thermally conductive element in one or more dielectric layers at a location of the heterostructure where a heat transfer path can be established in response to a thermal gradient generally directed from at least one of the arrays to the thermally conductive layer.
A method for fabricating a micro-scale device having internal heat spreading capability to reduce operating temperature, comprising the steps of:
A method for conducting current in a micro-scale interconnect device at a reduced device operating temperature, comprising the steps of:
Dependencies are inferred from the claim text.