Semiconductor device package and method of production and semiconductor device of same

A semiconductor device package providing a capacitor in a circuit board for mounting a semiconductor chip, wherein

• said capacitor is provided directly beneath a semiconductor chip mounting surface of said circuit board, and
• the connection surfaces of the external connection terminals to be directly connected with electrode terminals of said semiconductor chip among the external connection terminals of the capacitor are formed exposed at said semiconductor chip mounting surface.

A method of production of a semiconductor device package for producing a semiconductor device package providing a capacitor in a circuit board comprising:

• directly connecting external connection terminals of said capacitor to one surface of capacitor connection terminals to which said capacitor is to be connected among the connection pads formed in a state with the other surface to which electrode terminals of the semiconductor chip to be mounted are to be directly connected in close contact with one surface of a metal plate,
• forming a circuit board provided with a conductor circuit electrically connecting said connection pads and external connection terminals of the capacitor at one surface of said metal plate, and
• etching the other surface of said metal plate to expose the semiconductor mounting surface of the circuit board including at least that surface of the connection pads.

A method of production of a semiconductor device package for producing a semiconductor device package providing a capacitor in a circuit board comprising:

• mounting said capacitor so as to make one surface of the connection surfaces of the external connection terminals to which the electrode terminals of the semiconductor chip to be mounted are to be directly connected closely contact one surface of the metal plate,
• forming a circuit board provided with a conductor circuit electrically connected with other external connection terminals of the capacitor at that surface of said metal plate, and
• etching the other surface of said metal plate to expose a semiconductor mounting surface of the circuit board including at least the connection surfaces of the external connection terminals of the capacitor to which the electrode terminals of said semiconductor chip are to be directly connected.