Electronic component including a housing and a substrate

A method for fabricating an electronic component, the method which comprises:

• providing a first substrate having microscopically small contact surfaces connected to electrodes of elements of the electrical component via interconnects on the first substrate;
• applying a continuous conductive layer to a second substrate;
• obtaining a structured conductive layer by structuring the continuous conductive layer to form:
• a rewiring pattern having large-area regions for connecting to external contact surfaces, connecting tracks being disconnectable from the rewiring, and microscopically small regions for contact connection surfaces being sized and configured in a manner corresponding to said contact surfaces of the first substrate;
• coating the structured conductive layer with an insulating joining layer;
• producing passage openings through the insulating joining layer to the microscopically small regions of the structured conductive layer forming the rewiring;
• producing passage openings through the second substrate in regions of the external contact surfaces;
• filling the passage openings in the insulating joining layer and the passage openings in the second substrate with a conductive material;
• coating the contact connection surfaces and/or the contact surfaces with a metal alloy coating;
• activating a surface of the insulating joining layer;
• pressing the second substrate with the joining layer onto the first substrate, and simultaneously partially melting the metal alloy coating at a conditioning temperature;
• and
• maintaining the conditioning temperature until isothermally solidifying a connection between the contact surfaces and the contact connection surfaces.