Semiconductor module and method of producing a semiconductor module

A method of producing a semiconductor module, with the following method steps:

• at least one insulating element (2) is attached on a base element (1) or in a surface depression of the base element (1) by a first of two metallizations (21) arranged on opposite surfaces of the insulating element,
• semiconductor elements (6) are attached on the second of the two metallizations (22) and/or, if the insulating element (2) is arranged in a depression, on the surface of the base element (1),
• main and/or control terminals of the semiconductor elements (6) are contacted by wire connections (7) or other electrical conductors and connected to contacting areas (31) of contacting elements (3),
• characterized in that, before the semiconductor elements (6) are attached,
• the base element (1) and insulating element (2) together with the contacting elements (3) are introduced into a casting mold (41, 42),
• an insulating layer (51) is formed by filling the volume of the casting mold (44) not taken up by the base element (1), insulating element (2) or contacting element (3) with an electrically insulating material,
• the insulating layer (51) is cured and sufficient material is subsequently removed from the insulating layer (51) that the surface of the insulating layer (51) forms a common planar surface with the surface of the second of the two metallizations (22), with contacting areas (31) of the contacting elements (3) and, if the insulating element (2) is arranged in a depression, with the surface of the base element (1),
• and in that, after the semiconductor elements (6) have been attached,
• movable contacting pieces (32) of the contacting elements (3) are arranged upright, perpendicularly in relation to the surface of the insulating layer (51).