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US 2003/0116838 A1Published application
Supporting frame for surface-mount diode package
OwnerJiahn-Chang Wuinventor
Life of this patent
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Abstract
A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip.
Claims9
A surface mount diode package, comprising:
- diode chip having a first electrode and a second electrode;
- a first metallic contact coupled to said first electrode for surface mounting to a motherboard;
- a second metallic contact coupled to said second electrode for surface mounting to said mother board;
- a supporting frame surrounding said diode chip and solidly bridging between said first metallic contact and said second metallic contact.
1 more element
Dependencies are inferred from the claim text.