Semiconductor device and manufacturing method thereof

Abstract

A semiconductor device comprises: a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires. A method of manufacturing a semiconductor device comprises: preparing a base metal lead frame including a die pad and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; applying a non-benzotriazole series rustproof agent on the surface of said lead frame; performing die-bonding for fixing a semiconductor chip onto said die pad in a heated atmosphere by use of a non-metal series paste; performing wire-bonding to connect said electrodes on said semiconductor chip to the inner ends of said leads of said lead frame by use of copper wires; forming resin molded member by sealing said lead frame with a resin excluding some portions of said leads; and forming leads protruding from said resin molded member.

Dependencies are inferred from the claim text.