High density direct connect LOC assembly
AssigneeMicron Technology, Inc.
InventorTrung T. Doan
Life of this patent
Estimating the term…
Abstract
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die through a plurality of conductive traces. A plurality of leads extends from the lead frame over the conductive traces proximate the semiconductor die periphery and directly attaches to and makes electrical contact with the conductive traces in an LOC arrangement. Alternately, a connector may contact a portion of the conductive trace to make contact therewith.
Claims14
An assembly, comprising:
- a semiconductor die having a periphery and an active surface with at least one electric contact point disposed on said active surface;
- a conductive trace on said active surface, said at least one conductive trace comprising a first end electrically contacting said at least one electric contact point of said semiconductor die and a second end terminating proximate said semiconductor die periphery, said at least one conductive trace comprising a trace of extruded viscous conductive material on said active surface between said at least one electric contact point making contact therewith and the periphery of the semiconductor die;
- and
- a connector connected to and in electrical communication with said conductive trace second end.
The assembly of claim 8, wherein said at least one lead of a lead frame is abutted to and in electrical communication with a portion of said conductive trace second end.
An assembly, comprising:
- a semiconductor die having a periphery and an active surface having a plurality of electric contact points disposed on said active surface;
- a plurality of conductive traces on said active surface, each conductive trace of said plurality of traces comprising a first end electrically contacting at least one electric contact point of said plurality of contact points and a second end terminating proximate said semiconductor die periphery, said each conductive trace comprising a trace of extruded viscous conductive material on said active surface between said at least one semiconductor die electric contact point making contact therewith and the periphery of the semiconductor die;
- and
- a plurality of leads of a lead frame connected to and in electrical communication with said second ends of said plurality of conductive traces.
A wafer comprising:
- a plurality of semiconductor dice located on said wafer, each semiconductor die having a periphery, having an active surface, and having at least one bond pad on said active surface;
- and
- at least one conductive trace on said active surface of each of said plurality of semiconductor dice, said at least one conductive trace comprising a first end contacting said at least one bond pad of said semiconductor die and a second end terminating adjacent said periphery of said semiconductor die periphery, said at least one conductive trace comprising a trace of extruded viscous conductive material on said active surface between said at least one bond pad making contact therewith and the periphery of the semiconductor die.
Dependencies are inferred from the claim text.