Lead-frame strip and method of manufacturing semiconductor packages using the same

A method of fabricating a semiconductor package, the comprising the steps of:

• preparing a lead frame strip that includes at least one lead frame panel in which a plurality of unit lead frames are arranged in a matrix form, wherein each unit lead frame includes:
• a die pad in which a semiconductor chip is to be mounted;
• a tie bar, an end of which being connected to the die pad and processed to be downset;
• a plurality of leads positioned generally at the same level as other end of the tie bar and extended with a predetermined distance from the tie pad;
• a dam bar being formed across the leads in a manner to support the leads, wherein at least one slot is formed along edges of the lead frame panel and functions as a buffer and a connection bar is formed widthwise across the slot to support the lead frame panel;
• mounting a semiconductor chip to the die pad;
• performing wire bonding between the semiconductor chip and the leads and between the semiconductor chip and the die pad;
• molding the lead frame strip with resin so as to form an encapsulation with the lead frame strip mounted with semiconductor chip and bonded with wires;
• and
• cutting the molded lead frame strip into units of semiconductor packages.