Impedance compensation for curcuit board breakout region
AssigneeIntel Corporation
InventorsJames A. McCall, Steven M. Stahlberg, David N. Shykind
Life of this patent
Estimating the term…
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AssigneeIntel Corporation
InventorsJames A. McCall, Steven M. Stahlberg, David N. Shykind
Estimating the term…
In some embodiments, the invention includes system comprising a circuit board including a circuit board trace. This system includes a packaged chip supported by the circuit board including, the packaged chip having a package, wherein the circuit board trace is connected to the package in a circuit board breakout region, and wherein the circuit board trace includes a fan-out trace section having an impedance Zo1, a matching region trace section having an impedance Zo2, and a package trace compensation section having an impedance Zo3, wherein an effective impedance of the matching region trace section and the package trace compensation section is approximately equal to impedance Zo1, where Zo3<Zo1<Zo2.
A system comprising:
The system of claim l,wherein the effective impedance is essentially equal to Zo1.
A system comprising:
A system comprising:
A system comprising:
Dependencies are inferred from the claim text.