Image sensor structure

Abstract

The image sensor structure of the invention is used for electrically connecting to a printed circuit board. The image sensor structure includes a substrate, a projecting layer, an image sensing chip, a plurality of wires, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal output terminals for electrically connecting to the printed circuit board. The projecting layer has an upper surface and a lower surface. The lower surface is adhered to the second surface of the substrate to form a cavity with the substrate. The upper surface is formed with signal input terminals. The image sensing chip is placed within the cavity formed by the substrate and the projecting layer, and is adhered onto the second surface of the substrate. The plurality of wires each has a first terminal and a second terminal. The first terminals are electrically connected to the image sensing chip. The second terminals are electrically connected to the signal input terminals of the upper surface of the projecting layer. The transparent layer is placed on the upper surface of the projecting layer. According to the invention, the package volume of the image sensor can be reduced so as to facilitate the manufacturing of the package.

Dependencies are inferred from the claim text.