Method of manufacturing semiconductor substrate, semiconductor substrate, electro-optical apparatus and electronic equipment
AssigneeSeiko Epson Corporation
InventorsYasushi Yamazaki, Yukiya Hirabayashi
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Abstract
A method of manufacturing a semiconductor substrate includes the processes of: forming an insulation film on a surface of a semiconductor substrate main body; forming an ion shield member having a predetermined shape on the insulation film; implanting an ion into the semiconductor substrate main body from a side on which the insulation film is formed, to thereby form an ion implantation layer; removing the ion shield member; laminating the insulation film and a support substrate onto each other; and separating the semiconductor substrate main body from the support substrate at a portion of the ion implantation layer.
Claims7
A semiconductor substrate comprising:
- a support substrate;
- an insulation film laminated on a surface of said support substrate;
- and
- a semiconductor layer formed on said insulation film, said semiconductor layer having such a structure that thicknesses of said semiconductor layer are different in a layer thereof.
An electro-optical apparatus comprising:
- a pair of a support substrate and an opposite substrate sandwiching electro-optical substance therebetween;
- a plurality of first switching elements arranged in a form of matrix in correspondence with a pixel array, in an image display region of said support substrate;
- and
- a plurality of second switching elements arranged in a peripheral region, which is located around said image display region, of said support substrate and at least partially constituting a peripheral circuit,
- wherein a thickness of a semiconductor layer in the image display region constituting said first switching elements is thinner than a semiconductor layer in the peripheral region constituting said second switching elements.
An electronic equipment comprising a light source for emitting light, an electro-optical device for modulating the emitted light in correspondence with image information and a projecting device for projecting the modulated light,
- said electro-optical apparatus comprising:
- a pair of a support substrate and an opposite substrate sandwiching electro-optical substance therebetween;
- a plurality of first switching elements arranged in a form of matrix in correspondence with a pixel array, in an image display region of said support substrate;
- and
- a plurality of second switching elements arranged in a peripheral region, which is located around said image display region, of said support substrate and at least partially constituting a peripheral circuit,
- wherein a thickness of a semiconductor layer in the image display region constituting said first switching elements is thinner than a semiconductor layer in the peripheral region constituting said second switching elements.
Dependencies are inferred from the claim text.