Conductive adhesive and packaging structure using the same

A conductive adhesive for connecting electrically an electronic element and a substrate, comprising

• first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver,
• second particles having a standard electrode potential lower than a standard electrode potential of silver, and
• at least one agent selected from an activator and an antioxidant.

A packaging structure comprising an electronic element, a substrate and a conductive adhesive, the electronic element having an electrode electrically connected with an electrode of the substrate via the conductive adhesive,

• wherein the conductive adhesive comprises first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver.

A packaging structure comprising an electronic element, a substrate and a conductive adhesive, the electronic element having an electrode electrically connected with an electrode of the substrate via the conductive adhesive,

• wherein the conductive adhesive comprises first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and at least one compound selected from an oxide, a hydroxide, a chloride and a carbonate produced as a result of corrosion of second particles that have a standard electrode potential lower than a standard electrode potential of silver.

A packaging structure comprising an electronic element, a substrate and a conductive adhesive, the electronic element having an electrode electrically connected with an electrode of the substrate via the conductive adhesive,

• wherein the conductive adhesive comprises particles having a standard electrode potential that is equal or higher than a standard electrode potential of silver, wherein a metal compound coating having a standard electrode potential higher than the standard electrode potential of the particles is formed on a surface of at least one electrode having a standard electrode potential lower than that of the particles and the at least one electrode is selected from the electrode of the electronic element and the electrode of the substrate.