Passive alignment of optoelectronic components using laser-heating technology
OwnerYoung Bok Choi, Soo Jin Park +2inventors
InventorsYoung Bok Choi, Soo Jin Park, Ki Tae Jeong, Tae Sang Park
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Abstract
A plurality of solder layers are disposed on a substrate and an optical component is aligned on each of the solder layer. Laser beams are applied to a corresponding section of the substrate to heat a first solder layer on which a first optical component is positioned. Then, the first solder layer is cooled so that the first optical component is bonded to the substrate. Subsequently, laser beams are applied to a second solder layer to bond a second optical component thereon to the substrate.
Claims3
A method of aligning a plurality of optical components on a substrate, comprising the steps of:
- preparing a substrate;
- forming a plurality of solder layers on the substrate;
- aligning a plurality of optical components on the plurality of solder layers, respectively;
- radiating laser beams onto a corresponding section of the substrate to heat a first solder layer to a liquid phase, the first solder layer being then cooled so that a first optical component disposed on the first solder layer is bonded to the substrate;
- and
- radiating laser beams onto another corresponding section of the substrate to heat a second solder layer to a liquid phase, the second solder layer being then cooled so that a second optical component disposed on the second solder layer is bonded to the substrate.
Dependencies are inferred from the claim text.