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US 2003/0116546 A1Published application
Laser cutting machine and method
AssigneeTrumpf GmbH & Co.
InventorHans Klingel
Life of this patent
Estimating the term…
Abstract
A machine and a process for thermal cutting of workpieces has at least one workpiece support (8) for the workpiece, at least one thermal cutting device (2), and at least one machine device (10, 11) to move the workpiece support (8) and the cut product adhering to the workpiece support (8) after the workpiece is cut relative to at least one stop (10) to loosen cut product adhering to the workpiece support (8).
Claims18
A machine for thermal cutting of workpieces comprising:
- (a) at least one workpiece support (8, 88, 108) for the workpiece to be cut;
- (b) at least one cutting device (2);
- (c) at least one stop (10, 30, 50, 90, 110) for cut product adhering to the workpiece support (8, 88, 108);
- and
- (d) at least one mechanical device (10, 11, 36, 3, 50, 3, 10, 78, 88, 90, 108, 110) for producing relative movement between the stop (10, 30, 50, 90, 110) and the workpiece support (8, 88, 108) and cut product adhering to the workpiece support (8, 88, 108) after cutting a workpiece, to impact the adhering cut product with the stop to effect release thereof.
2 more elements
In a process for thermal cutting of workpieces, the steps comprising:
- (a) thermally cutting a workpiece on a workpiece support to produce free cut product (10) freely resting on a workpiece support (8) and cut product adhered to said workpiece support;
- and
- (b) moving said workpiece support relative to a stop to cause said cut product adhering to the workpiece support (8) to abut the stop to free it from the workpiece support (8).
Dependencies are inferred from the claim text.