Electroplater and method
AssigneeTexas Instruments Incorporated
InventorsRichard L. Guldi, Jiong-Ping Lu, David Gonzalez JR.
Life of this patent
Estimating the term…
Abstract
A method for rinsing a substrate held by a substrate holder in an electroplater includes positioning at least a first portion of the substrate holder and an electroplating bath in the electroplater relative to one another such that the substrate and the first portion of the substrate holder are removed from the electroplating bath. A retractable shutter in the electroplater is closed to where the closed retractable shutter is located between the first portion of the substrate holder and the electroplating bath as positioned. The substrate is rinsed with a solution wherein the closed retractable shutter prevents substantially all of the solution from entering into the electroplating bath.
Claims20
A method for rinsing a substrate held by a substrate holder in an electroplater, comprising:
- positioning at least a first portion of the substrate holder and an electroplating bath in the electroplater relative to one another such that the substrate and the first portion of the substrate holder are removed from the electroplating bath;
- closing a retractable shutter in the electroplater, wherein the closed retractable shutter is located between the first portion of the substrate holder and the electroplating bath as positioned;
- and
- rinsing the substrate with a first solution wherein the closed retractable shutter prevents substantially all of the solution from entering into the electroplating bath.
A method of cleaning, comprising:
- positioning at least a first portion of a substrate holder and an electroplating bath in an electroplater relative to one another such that the first portion of the substrate holder is removed from the electroplating bath;
- closing a retractable shutter in the electroplater, wherein the closed retractable shutter is located between the first portion of the substrate holder and the electroplating bath as positioned;
- and
- rinsing the substrate holder with a first solution, wherein the closed retractable shutter prevents substantially all of the solution from entering into the electroplating bath.
An electroplater, comprising:
- an electroplating bath;
- a substrate holder operable to hold a substrate in the electroplating bath during electroplating of the substrate;
- a first nozzle operable to dispense a first solution;
- and
- a retractable shutter in the electroplater, wherein the retractable shutter is operable to be opened or closed, wherein when the retractable shutter is closed, it is located between at least a first portion of the substrate holder and the electroplating bath as positioned.
Dependencies are inferred from the claim text.