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US 2003/0116429 A1Published application
Apparatus for continuous processing of semiconductor wafers
AssigneeMicron Technology, Inc.
InventorsSalman Akram, David R. Hembree
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Abstract
An electrochemical reaction assembly of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly achieves a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.
Claims16
An apparatus for semiconductor substrate fabrication, comprising:
- a hollow first electrode disposed within a chamber;
- and
- a second electrode which is adapted to removably engage at least one semiconductor substrate, said apparatus being configured to move said second electrode through said hollow first electrode;
- wherein said hollow first electrode and said second electrode are each electrically communicable to an electrical power supply to receive electrical power therefrom.
1 more element
Dependencies are inferred from the claim text.