Method of depositing heusler alloy thin film by co-sputtering
OwnerKee-won Kim, Wan-Jun Park +3inventors
InventorsKee-won Kim, Wan-Jun Park, Tae-wan Kim, I-hun Song, Sang-jin Park
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Abstract
A method of manufacturing a Heusler alloy thin film by co-sputtering is provided. The Heusler alloy thin film has a general structural formula of either X2YZ or XYZ and is deposited by co-sputtering using a deposition apparatus having a substrate placed on a substrate holder in a chamber and targets positioned on a target bracket spaced apart from the substrate. Components of the Heusler alloy thin film are placed on the target bracket as either single targets or binary alloy targets. Thus, it is easy to manufacture a Heusler alloy thin film having excellent magnetic characteristics.
Claims9
A method of manufacturing a Heusler alloy thin film having a structural formulas of either X2YZ or XYZ deposited by co-sputtering using a deposition apparatus having a substrate placed on a substrate holder in a chamber and targets positioned on a target bracket spaced apart from the substrate,
- wherein components of the Heusler alloy thin film are placed on the target bracket as either single targets or binary alloy targets.
Dependencies are inferred from the claim text.