Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles
AssigneeNikko Materials Co., Ltd.
InventorsTakeo Okabe, Yasuhiro Yamakoshi, Hirohito Miyashita
Life of this patent
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Abstract
A sputtering target producing few particles, a backing plate or a sputtering apparatus, and a sputtering method producing few particles. An arc-spraying coating film and a plasma-spraying coating film over the former are formed on the sputtering target, a backing plate, or another surface in the sputtering apparatus, where an unwanted film might be formed. Thus a deposit is prevent from separating/flying from the target, backing plate, or another surface where an unwanted film might be formed in the sputtering apparatus.
Claims10
A sputtering target, backing plate or sputtering apparatus producing few particles, characterized in that an arc-spraying coating film and a plasma-spraying coating film over the former are formed on the sputtering target, backing plate or another surface in the sputtering apparatus where an unwanted film might be formed.
A sputtering method producing few particles, characterized in that an arc-spraying coating film and a plasma-spraying coating film over the former are formed on the sputtering target, backing plate or another surface in the sputtering apparatus where an unwanted film might be formed.
Dependencies are inferred from the claim text.