Flexible wiring boards and manufacturing processes thereof
AssigneeSony Chemicals Corp.
InventorYutaka Kaneda
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Abstract
A process for manufacturing a flexible wiring board with easy handling at reduced production costs comprises the steps of forming a first wiring pattern and a guide pattern around the outer periphery of the first wiring pattern on a copper foil, and forming an insulating film on the first wiring pattern and guide pattern.
Claims17
A process for manufacturing a flexible wiring board comprising forming a wiring pattern and a reinforcing guide pattern by etching a metal foil on an insulating substrate.
A flexible wiring board comprising a wiring pattern formed of a desired metal on a film-like insulating substrate wherein a reinforcing guide pattern having a same material as that of the wiring pattern is formed on the insulating substrate.
Dependencies are inferred from the claim text.