Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsSeiichi Nakatani, Koichi Hirano, Mikinari Shimada, Yasuhiro Sugaya
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Abstract
A capacitor-mounted metal foil of the present invention is provided with a metal foil and a plurality of capacitors formed on the metal foil. Each of the capacitors includes a conductive layer disposed above the metal foil, and a dielectric layer disposed between the metal foil and the conductive layer.
Claims52
A capacitor-mounted metal foil provided with a metal foil and a plurality of capacitors formed on the metal foil, each of the capacitors comprising:
- a conductive layer disposed above the metal foil;
- and a dielectric layer disposed between the metal foil and the conductive layer.
A circuit board, comprising:
- an insulating base;
- a plurality of wiring patterns formed on at least two principal planes of the base;
- inner vias formed in the base so as to connect the plurality of wiring patterns to each other;
- and
- a plurality of capacitors formed on a surface of at least one wiring pattern selected from the plurality of wiring patters,
- wherein each of the capacitors includes a conductive layer disposed above the at least one wiring pattern and a dielectric layer disposed between the at least one wiring pattern and the conductive layer.
A method for producing a capacitor-mounted metal foil comprising a metal foil and a plurality of capacitors formed on the metal foil, the method comprising:
- (a) forming a metal layer disposed on a part of the metal foil and a dielectric layer disposed on the metal layer;
- and
- (b) forming a conductive layer on the dielectric layer.
A method for producing a capacitor-embedded circuit board, comprising:
- (i) forming capacitors on a metal foil;
- (ii) laminating a prepreg in which inner vias are formed and the metal foil on each other so that the capacitors are embedded in the prepreg;
- (iii) curing the prepreg;
- and
- (iv) removing a part of the metal foil to form a wiring pattern,
- wherein the process (i) includes (a) forming a metal layer disposed on a part of the metal foil and a dielectric layer disposed on the metal layer and (b) forming a conductive layer on the dielectric layer.
Dependencies are inferred from the claim text.