Printed wiring board and method for producing the same
AssigneeSony Corporation
InventorsKazuhiro Shimzu, Nobuo Komatsu, Soichiro Kishimoto
Life of this patent
Estimating the term…
Abstract
A printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5 and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.
Claims10
A printed wiring board comprising:
- a rigid substrate including a land on at least one surface of a core material;
- and
- a flexible substrate including a bump, protuberantly formed on at least one surface of an insulating layer for establishing electrical connection to said land, and a land on the other surface thereof;
- said rigid substrate and the flexible substrate being molded as one with each other, with the interposition of an adhesive in-between, so that said land and the bump face each other.
A method for producing a printed wiring board comprising the steps of:
- forming a rigid substrate including a land on at least one surface of a core material;
- forming a flexible substrate including a bump, protuberantly formed on at least one surface of an insulating layer for establishing electrical connection to said land, and a land on the other surface thereof;
- and
- molding said rigid substrate and the flexible substrate together by vacuum hot pressuring, with the interposition of an adhesive in-between, so that said land and the bump face each other.
Dependencies are inferred from the claim text.