US 2003/0116282 A1 · Adhesive attachment assembly with heat source

Abstract

An adhesive attachment assembly is provided for mounting an attachment member such as a threaded stud or the like onto a substrate, wherein the attachment assembly includes a heat source for rapidly curing a selected adhesive bonding agent. The adhesive attachment assembly includes a first attachment component defining a base surface for receiving the curable bonding agent thereon, and a second attachment component adapted for temporary connection to the substrate. Upon pressed mounting of the first attachment component with bonding agent thereon onto the substrate, the second attachment component is movable into temporary engagement with the substrate, and a spring member reacts between the first and second attachment components to apply a positive force urging the first attachment component toward the substrate for the duration of the bonding agent cure time. A heat source is carried by the first attachment component for activating and/or rapidly curing the bonding agent.

Claims32

Dependent claims

An adhesive attachment assembly, comprising:

a first attachment component defining a base surface;
a heat activated member including a curable bonding agent mounted on said base surface, said bonding agent being for bonded attachment of said first attachment component to a substrate;
a second attachment component carried by said first attachment component for movement between first and second positions respectively retracted from and advanced toward the substrate, when said first attachment component is seated against the substrate;
an attachment member for at least temporarily securing said second attachment component to the substrate, when said heat activated member mounted on said base surface of said first attachment component is seated against the substrate with said second attachment component in said second position;
a spring member reacting between said first and second attachment components for urging said base surface of said first attachment component with a positive force against the substrate when said second attachment component is in said second position;
and
a heat source for delivering heat energy to said heat activated member for rapidly curing said bonding agent.

4 more elements

Dependencies are inferred from the claim text.

Adhesive attachment assembly with heat source

Life of this patent

Adhesive attachment assembly with heat source

Life of this patent

Abstract

Claims32