Chuck for holding a workpiece
AssigneeASM Automation Assembly Ltd
InventorsYiu Ming Cheung, Ka Wing Wong
Life of this patent
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Abstract
The invention provides a chuck for holding a workpiece, such as a chip-array semiconductor Chip Scale Packages (CSP) substrate, having a plurality of components such as CSPs to be singulated, and chaff areas of the components. The chuck comprises means to hold the chaff areas when the components are being singulated, that may include a first pressure means to hold the components and a second pressure means to hold the chaff areas.
Claims12
A chuck for holding a workplece having a plurality of components to be singulated and chaff areas of the components, comprising means to hold the chaff areas when the components are being singulated.
A method of dicing a workplece comprising a plurality of components held to a chuck, and removing chaff areas of the workpiece, including the steps of:
- providing a first pressure means to hold each component of the workpiece to the chuck;
- providing a second pressure means to hold the chaff areas to the chuck;
- and
- dicing the workpiece to separate the plurality of components, and tho chaff area.
Dependencies are inferred from the claim text.