Apparatus for modifying the configuration of an exposed surface of a viscous fluid

An apparatus for applying viscous material to one or more underside surfaces of at least one semiconductor component, comprising:

• a reservoir for providing an exposed surface of a viscous material contained therein to only one or more underside surfaces of at least a portion of at least one semiconductor component positioned thereover, the reservoir comprising at least one pool chamber in fluid communication with a viscous inflow chamber, the at least one pool chamber defined by at least one upward facing opening, the reservoir shaped such that the exposed surface of viscous material may be supplied to a precise location above the at least one upward facing opening, the viscous material having a surface tension;
• at least one first mechanism configured to raise and lower the viscous material to a desired selectable height above the at least one upward facing opening;
• and
• at least one second mechanism associated with the reservoir, the at least one second mechanism configured to level the exposed surface of viscous material above the at least one upward facing opening, to maintain the exposed surface of viscous material at a substantially constant height and to increase the effective exposed surface of viscous material.

An apparatus for applying adhesive material to one or more underside surfaces of at least one semiconductor component, comprising:

• an adhesive reservoir comprising at least one upward facing opening and configured to provide an exposed surface of an adhesive material contained therein to each of one or more underside surfaces of at least one semiconductor component positioned thereover and to avoid contacting the exposed surface of adhesive material with a bond wire surface of each of the at least one semiconductor components, the adhesive material exhibiting a surface tension;
• at least one first mechanism associated with the adhesive reservoir, the at least one first mechanism configured to raise and lower the adhesive material to a desired selectable height;
• and
• at least one second mechanism associated with the adhesive reservoir, the at least one second mechanism configured to level the exposed surface of adhesive material at a precise location above the at least one upward facing opening.