Interlocking interference-fit post system for interconnecting thermoplastic platforms

A thermoplastic molded post system for interconnecting two thermoplastic molded platforms consisting of a top platform having an outer side and an inner side and a bottom platform having an outer side and an inner side by means of a fastener-free interference-fit of two single cell thermoplastic post halves, one half of which protrudes downward from the inner side of the top platform and the other half protrudes upwards from the inner side of the bottom platform, each post half having drafted walls asymmetrically stepped to create a male-female fitting when joined with each free edge of said post half having a convex round and concave round where the wall is stepped wherein the convex round of the free edge and the concave round of the post half protruding from the inner side of the top platform engage the concave and the convex rounds, respectively, of the protrusion from the inner side of the bottom platform.