Method for vacuum drying of substrate

Abstract

A method for vacuum drying of a substrate which can eliminate not only the moisture adhered to the substrate surface but also the moisture impregnated inside of the films which form the devices in a shot time without deforming nor deteriorating the devices formed on the substrate in the drying. The method for vacuum drying of a substrate, concerning a method for drying a substrate by processing the substrate surface in a desired condition, cleaning the processed substrate with cleaning liquid, and drying the cleaned substrate, comprises the steps of heating the substrate surface to a predetermined temperature to vaporize the moisture of the surface as vapor and thereby detach the moisture from the substrate to outside, and vacuuming the detached vapor at a predetermined vacuum pressure to eliminate the moisture from the wafer.

Dependencies are inferred from the claim text.