Method of making an interposer with contact structures

A method for making a contact structure that makes electrical contact with an electrical lead of an integrated circuit package, the method comprising:

• providing a substrate including a dielectric material;
• forming a depression into said substrate, said depression having an inside surface defined thereon;
• forming a conductive layer disposed over at least a portion of said inside surface of said depression, said depression being sized and positioned such that said conductive layer may electrically engage said electrical lead;
• and
• forming an electrical trace disposed over a surface of said substrate, said electrical trace being:
• positioned in electrical contact with said conductive layer;
• and
• composed of a conductive material so as to provide electrical communication between said conductive layer and external circuitry.

A method of making an interposer structure for providing electrical communication between an array of electrical leads of an integrated circuit and external circuitry, the method comprising:

• providing a substrate including a dielectric material;
• and
• forming an array of contact structures over said substrate, said array of contact structures being sized and spaced so as to electrically engage said array of electrical leads, each of said contact structures including:
• a raised member extending away from said substrate and having a top surface distal to said substrate;
• a conductive layer disposed over at least a portion of said top surface of said raised member;
• and
• an electrical trace disposed over a surface of said substrate, said electrical trace being in electrical contact with said conductive layer, said electrical trace comprising a conductive material so as to provide electrical communication between said conductive layer and said external circuitry.

A method of making an interposer structure for providing electrical communication between an array of electrical leads of an integrated circuit and external circuitry, the method comprising:

• providing a substrate including a dielectric material;
• and
• forming an array of contact structures on said substrate, said array of contact structures being sized and spaced so as to be capable of electrically engaging said array of electrical leads, wherein each of said contact structures is formed by:
• forming a depression into said substrate, said depression having an inside surface defined thereon;
• forming a conductive layer disposed over at least a portion of said inside surface of said depression;
• forming an electrical trace disposed over a surface of said substrate;
• and
• electrically connecting said electrical trace with said conductive layer, wherein said electrical trace comprises a conductive material so as to provide electrical communication between said conductive layer and said external circuitry.