Self-aligned contact areas for sidewall image transfer formed conductors
AssigneeInternational Business Machines Corporation
InventorsEdward W. Conrad, Chung H. Lam, Dale W. Martin, Edmund Sprogis
Life of this patent
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Abstract
A method and structure for forming a sidewall image transfer conductor having a contact pad includes forming an insulator to include a recess, depositing a conductor around the insulator, and etching the conductor to form the sidewall image transfer conductor, wherein the conductor remains in the recess and forms the contact pad and the recess is perpendicular to the sidewall image transfer conductor.
Claims20
A process for forming a sidewall image transfer conductor having a contact pad comprising:
- forming an insulator to include a recess;
- depositing a conductor around said insulator;
- and
- etching said conductor to form said sidewall image transfer conductor,
- wherein said conductor remains in said recess and forms said contact pad and said recess is perpendicular to said sidewall image transfer conductor.
An integrated circuit chip comprising:
- an insulator having a recess;
- a sidewall conductor positioned along said insulator, wherein said recess is perpendicular to said sidewall conductor;
- and
- a contact pad in said recess.
An integrated circuit chip comprising:
- an insulating mandrel having a linear edge and a non-linear feature along said linear edge;
- and
- a sidewall conductor positioned along said linear edge and said non-linear feature,
- wherein said sidewall conductor within said non-linear feature comprises a contact pad for said sidewall conductor.
Dependencies are inferred from the claim text.