Flame-retardant epoxy resin composition, molded object thereof, and electronic part
AssigneeOtsuka Kagaku Kabushiki Kaisha
InventorsMasatoshi Taniguchi, Yuji Tada, Yoichi Nishioka
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AssigneeOtsuka Kagaku Kabushiki Kaisha
InventorsMasatoshi Taniguchi, Yuji Tada, Yoichi Nishioka
Estimating the term…
The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.01 to 70% by weight and in the range of 0 to 70% by weight, respectively, relative to a total quantity of the epoxy resin (A), the phosphazene compound (B) and the epoxy hardener (C), and the inorganic filler (D) is included in the range of 0 to 95% by weight relative to a total quantity of the epoxy resin (A), the phosphazene compound (B), the epoxy hardener (C) and the inorganic filler (D), wherein the phosphazene compound (B) is at least one selected from the group consisting of (1) a cyclic and/or a chain phosphazene compound with a specific structure, (2) a polymer of the cyclic and/or the chain phosphazene compound; and (3) a reaction product of the cyclic and/or the chain phosphazene compound with one type of a compound selected from the group consisting of an epoxy compound, a phenol compound, an amine compound and an acid anhydride.
A flame-retardant epoxy resin composition comprising an epoxy resin (A) and a phosphazene compound (B), wherein said phosphazene compound (B) is included in the range of 0.01 to 70% by weight relative to a total quantity of said epoxy resin (A) and said phosphazene compound (B), and
A flame-retardant epoxy resin composition comprising an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein said phosphazene compound (B) and said epoxy hardener (C) are included in the range of 0.01 to 70% by weight and in the range of 0 to 70% by weight, respectively, relative to a total quantity of said epoxy resin (A), said phosphazene compound (B) and said epoxy hardener (C), and said inorganic filler (D) is included in the range of 0 to 95% by weight relative to a total quantity of said epoxy resin (A), said phosphazene compound (B), said epoxy hardener (C) and said inorganic filler (D) and
Dependencies are inferred from the claim text.