Organic compositions

A method of lowering the dielectric constant of a composition comprising (a) thermosetting component comprising:

• (1) optionally monomer of Formula I
• 42
• and (2) at least one oligomer or polymer of Formula II
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• where said E is a cage compound;
• each of said Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein said substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl;
• said G is aryl or substituted aryl where substituents include halogen and alkyl;
• said h is from 0 to 10;
• said i is from 0 to 10;
• said j is from 0 to 10;
• and said w is 0 or 1;
• (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with said thermosetting component (a) and the second functionality is capable of interacting with a substrate when said composition is applied to said substrate
• comprising the steps of:
• bonding porogen to said thermosetting component;
• decomposing said bonded porogen;
• and
• volatilizing said porogen whereby pores form in said composition.