Method and apparatus for face-up substrate polishing

A polishing apparatus, comprising:

• a basin;
• a substrate carrier disposed in the basin and having a substrate receiving pocket adapted to retain a substrate during processing;
• a housing supported above the basin;
• a conductive pad coupled to the housing and having a diameter less than a diameter of the substrate receiving pocket;
• and
• an electrode disposed in the housing, wherein the basin and housing are adapted to retain a fluid that provides an electrical pathway through the conductive pad between the electrode and the substrate disposed in the substrate receiving pocket.

A polishing apparatus, comprising:

• a basin adapted to support a substrate in a face-up orientation;
• a polishing head having a housing supported above the basin;
• a conductive pad coupled to the housing and substantially enclosing an interior volume of the housing;
• and
• an electrode disposed in the interior volume of the housing.

A polishing apparatus, comprising:

• a basin;
• a carrier disposed in the basin and adapted to support a substrate in a face-up orientation;
• a housing supported above the basin and having an electrode disposed therein;
• a conductive pad coupled to the housing between the electrode and the carrier;
• and
• a vent formed through the housing and adapted to allow gas to escape from the housing.

A polishing apparatus, comprising:

• a basin adapted to support a substrate in a face-up orientation;
• a carrier disposed in the basin and having a substrate supporting surface;
• a substrate retainer extending above the carrier and at least partially circumscribing the substrate supporting surface to define a substrate receiving pocket;
• a polishing head supported above the basin and including an electrode disposed therein;
• a conductive pad coupled to the housing between the electrode and the carrier, the conductive pad having a diameter less than a diameter of the substrate receiving pocket;
• and
• a vent formed through the housing for releasing gases generated while polishing a substrate.

A conductive pad comprising:

• a dielectric base;
• a plurality of posts extending from a first side of the base;
• and
• a conductive contact pad disposed on at least one of the posts.

A method of polishing a substrate, comprising:

• retaining a substrate in a face-up orientation in a basin;
• contacting the substrate with a conductive pad coupled to a polishing head, the polishing head having an electrode disposed therein;
• flowing electrolyte between the conductive pad and the electrode;
• biasing the conductive pad and electrode;
• polishing the substrate;
• and
• venting gases evolved during polishing through the polishing head.

A method of polishing a substrate, comprising:

• retaining a substrate in a face-up orientation inside a ring;
• contacting the substrate with a conductive pad coupled to a polishing head, the polishing head having an electrode disposed therein;
• flowing electrolyte between the conductive pad and electrode;
• and
• biasing the conductive pad and the electrode.

A method of polishing a substrate, comprising:

• contacting a substrate with a conductive pad in a polishing motion defined by the relative movement between the conductive pad and substrate and having a range of motion of at least less than or equal to a surface area of the substrate;
• flowing electrolyte between an electrode and the conductive pad;
• and
• biasing the conductive pad and the electrode.