Method and apparatus for polishing substrates
AssigneeApplied Materials, Inc.
InventorsYongsik Moon, Kapila Wijekoon
Life of this patent
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Abstract
Method and apparatus for polishing substrates. A chemical mechanical polishing article comprises a body and a patterned surface. The patterned surface comprises a plurality of slurry distribution grooves and a plurality of islands on the body. Each of the plurality of the islands comprise a base portion and a tip portion disposed on the base portion. The base portion comprises a sidewall defining at least a portion of the plurality of slurry distribution grooves and the tip portion has a decreasing diameter from the base portion to an upper polishing surface. In a particular embodiment, conductive materials and low k dielectric films are polished with reduced or minimum substrate surface damage and peeling.
Claims21
A polishing article, comprising:
- a body;
- a patterned surface on the body, comprising:
- a plurality of raised upper polishing areas;
- a recessed area defined by the plurality of raised upper polishing areas;
- and
- a contoured surface disposed at a perimeter of and extending from each of the plurality of raised upper polishing areas.
A chemical mechanical polishing article, comprising:
- a body;
- and
- a patterned surface comprising a plurality of slurry distribution grooves and a plurality of islands on the body, each of the plurality of the islands comprising:
- an upper polishing surface;
- a sidewall defining at least a portion of the plurality of slurry distribution grooves;
- and
- a contoured surface disposed between the upper polishing area and the sidewall.
A chemical mechanical polishing article, comprising:
- a body;
- a patterned surface comprising a plurality of slurry distribution grooves and a plurality of the islands on the body, each of the plurality of the islands comprising:
- a base portion comprising a sidewall defining at least a portion of the plurality of slurry distribution grooves;
- and
- a tip portion disposed on the base and having a decreasing diameter from the base portion to an upper polishing surface.
A method of polishing materials disposed on a substrate, comprising:
- contacting a patterned surface of a chemical mechanical polishing article with material disposed on a substrate surface, wherein the patterned surface comprises a plurality of slurry distribution grooves and a plurality of the islands on the body, each of the plurality of the islands comprising:
- a base portion comprising a sidewall defining at least a portion of the plurality of slurry distribution grooves;
- and
- a tip portion disposed on the base and having a decreasing diameter from the base portion to an upper polishing surface;
- and
- providing relative motion between the patterned surface and the substrate.
Dependencies are inferred from the claim text.