Coverless ZIF socket for mounting an integrated circuit package on a circuit board
AssigneeIntel Corporation
InventorDonald T. Tran
Life of this patent
Estimating the term…
Abstract
A zero insertion force socket for an integrated circuit package. In an embodiment, the socket has an uncovered base, a plurality of conductive contacts coupled to the base, and a slidable bar coupled to the base.
Claims30
A socket comprising:
- an uncovered base;
- a plurality of conductive pin contacts coupled to the base;
- and
- a slidable bar coupled to the base.
A socket for an integrated circuit package, the socket comprising:
- a base to directly contact to a substrate of the integrated circuit package;
- and
- a bar coupled to the base to directly apply an actuation force to the substrate.
A socket for an integrated circuit package, the socket comprising,
- a base;
- a plurality of contacts coupled to the base;
- and
- a means for directly applying an actuation force to a substrate of the integrated circuit package so that pins of the integrated circuit package engage the contacts.
A method of connecting an integrated circuit package to a socket, the method comprising:
- moving a bar along a base of the socket in a direction away from guide-holes in the socket base;
- inserting a plurality of pins of the integrated circuit package into the guide-holes in the socket base;
- and
- moving the bar towards the guide-holes so that a force is applied directly by the bar to a substrate portion of the integrated circuit package.
A circuit board comprising:
- a board;
- a coverless zero insertion force socket;
- and
- an integrated circuit package mounted to the coverless zero insertion force socket.
An apparatus comprising a zero insertion force socket, the socket comprising a base, a plurality of contacts coupled to the base, and a bar coupled to the base, wherein said socket does not have a cover.
Dependencies are inferred from the claim text.