Contact for ball grid array connector
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsGenn-Sheng Lee, Ming-Lun Szu
Life of this patent
Estimating the term…
Abstract
A contact for being received in an electrical socket which interconnects an integrated circuit (IC) package with a printed circuit board (PCB), comprises a contact portion for electrically connecting with a pin of the IC package, a locating portion for interferentially engaging with insulative housing of the electrical socket, and a tail portion having a plurality of clip arms. When a solder block is inserted into the tail portion, the clip arms can deflect to secure the solder block in a predetermined position in the tail portion.
Claims8
A contact for being received in an electrical socket which interconnects an integrated circuit (IC) package with a printed circuit board (PCB), the contact comprising:
- a contact portion for electrically connecting with a pin of the IC package;
- a locating portion for interferentially engaging with insulative housing of the electrical socket;
- and
- a tail portion having a plurality of clip arms;
- wherein
- when a solder block is engaged with the tail portion, the clip arms are deflectable to secure the solder block in a predetermined position in the tail portion.
A contact including a locating portion, a resilient contact portion extending upwardly from said locating portion, a connection portion downwardly extending from said locating portion, and a horizontal tail portion horizontally extending from a lower end of said connection portion with redially expansibility thereof and defining therein an opening extending therethrough in a vertical direction, and a solder block forcibly inserted into said opening and retained by said tail portion.
Dependencies are inferred from the claim text.