Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon
AssigneeKabushiki Kaisha Toshiba
InventorKaoru Miyagawa
Life of this patent
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Abstract
A printed wiring board comprises a substrate having a packaging area to mount a circuit component, a plurality of pads arranged in a grid on the packaging area of the substrate, and a plurality of conductive patterns connected to the pads. At least a few of the pads located at the periphery of the packaging area are made smaller than those located inside.
Claims20
A printed wiring board comprising:
- a substrate having a packaging area to mount a circuit component with a plurality of connection terminals;
- a plurality of pads arranged in a grid on the packaging area on said substrate, said pads electrically connected to the connection terminals of said circuit component, wherein at least a few of said pads located at the periphery of said packaging area are made smaller than those located inside;
- and
- a plurality of conductive patterns connected to each of said pads, wherein at least a few of said conductive patterns are led out of said packaging area passing through adjacent pads.
A surface mount circuit component to be mounted on a printed wiring board comprising a substrate having a packaging area, a plurality of pads arranged in a grid on said packaging area and a plurality of conductive patterns electrically connected to said pads, said surface mount circuit component comprising:
- a terminal surface facing the packaging area of said printed wiring board;
- and
- a plurality of connection terminals arranged in a grid on said terminal surface, wherein said connection terminals are electrically connected to said pads, and at least a few of said connection terminals located at the periphery of said terminal surface are smaller than those located inside.
A circuit module comprising:
- a printed wiring board including a substrate having a packaging area, a plurality of pads arranged in a grid on said packaging area and a plurality of conductive patterns electrically connected to said pads, wherein at least a few of said pads located at the periphery of said packaging area are smaller than the others located inside;
- and
- a surface mount circuit component mounted on said packaging area of said substrate, said circuit component including a surface facing said packaging area and a plurality of connection terminals arranged in a grid on said surface and electrically connected to said pads, wherein at least a few of said connection terminals located at the periphery of the terminal surface are smaller than the others located inside.
Dependencies are inferred from the claim text.