Apparatus and method for producing semiconductors

A semiconductor manufacturing method comprising:

• an integrated measuring instrument for measuring the form or size of the element to be formed into a wafer;
• an etching means for etching said wafer by making use of plasma generated under reduced pressure;
• an ashing means for ashing said etched wafer;
• a wetting means for wetting said etched wafer;
• a drying means for drying the wafer which has gone through said wetting work;
• a transport means whereby the wafers introduced into a wafer cassette are transported successively to said integrated measuring instrument and each working unit;
• and
• a transport chamber in which said integrated measuring instrument, etching means, ashing means, wetting means, drying means and transport means are connected by a depressurizable transport passage, and which is provided with a wafer cassette inlet for receiving the cassette containing a plural number of sheets of wafer to be etched,
• wherein the wafers contained in said cassette are transported one by one successively to said integrated measuring instrument and each working unit by said transport means and treated.