Microelectronic spring contact repair

A method for forming a microelectronic spring contact, the method comprising:

• depositing a release layer over a substrate;
• depositing a seed layer of conductive material over the release layer;
• depositing a layer of sacrificial layer over the seed layer;
• patterning the sacrificial layer to form at least one recess exposing the seed layer in the shape of the side profile of a microelectronic spring contact;
• filling the at least one recess with a resilient material;
• removing the layer of sacrificial layer to reveal a microelectronic spring contact comprising a base and an arm extending from the base, wherein the base and the arm are adhered along sides thereof to the substrate and an axis of the microelectronic spring contact extending between a distal tip of the arm and the base is parallel to the substrate;
• and
• releasing the microelectronic spring contact entirely from the substrate.

A method for repairing a microelectronic spring contact comprising a beam bonded to at least one post that is in turn bonded to a terminal of a substrate, the method comprising:

• removing the beam from the at least one post, thereby providing a removed beam;
• removing at least a portion of the at least one post from the terminal;
• aligning a replacement post piece over the terminal, the replacement post piece comprising a base configured to fit over the terminal, and at least one replacement post extending upwards from the base, whereby the replacement post piece is aligned so that the base of the replacement post piece is opposite to the terminal and the at least one replacement post extends away from the substrate;
• bonding the replacement post piece to the terminal;
• and
• bonding a replacement beam to the at least one replacement post,
• wherein the replacement beam is selected from a group consisting of the removed beam and a new beam essentially identical to the removed beam.