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US 2003/0113979 A1Published application
Process for making contact with and housing integrated circuits
AssigneeSchott Glas
InventorsFlorian Bieck, Jurgen Leib
Life of this patent
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AssigneeSchott Glas
InventorsFlorian Bieck, Jurgen Leib
Estimating the term…
The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the to the terminal contact [sic] and therefore a contact location which is electrically connected to the terminal contact can be produced on that side of the substrate material which is remote from the active surface, it being possible to dispense both with trenches which run along the substrate material and with a lateral contact which leads around the component in accordance with the prior art.
A process for producing electrical contact connections for at least one component which is integrated in a substrate material (1, 10), the substrate material (1, 10) having a first surface region (13), and
A process for fabricating integrated circuits (6) with a wafer (1) which has a substrate, at least one terminal contact (25) and, on a first side (14), an active layer (11) which comprises the circuits of the chip (1, 2, 3), which process comprises the following steps:
A device which comprises at least one component which is integrated in a substrate material, the substrate material (1) comprising a first surface region (13), which lies opposite a second surface region, and at least one terminal contact (12) being arranged at least partially in the first surface region for each integrated circuit, wherein the device includes at least one further contact location in the second surface region, which is connected to the terminal contacts via at least one electrical contact connection, the contact connection being produced via contact passages which are introduced into the substrate material and lie transversely with respect to the first surface region.
An integrated circuit arrangement, comprising a chip (1, 2, 3), which includes a substrate, at least one terminal contact (25) and, on one side (14), an active layer (11) which comprises the circuits of the chip (1, 2, 3), wherein a covering (20) of glass or transparent plastic is secured to one side (14, 22) of the chip (1), and the substrate is thinned on the opposite side, and the chip has a conductive passage (19) which is introduced from a second side, which is opposite to the side which includes the active layer, of the first chip (1), and the covering having been secured before the thinning and introduction of the passage, there being an electrical contact between at least one terminal of the circuits of the chip (1) and the conductive passage.
Dependencies are inferred from the claim text.