Back to results
US 2003/0113976 A1Published application
Wafer-bonding using solder and method of making the same
AssigneeIntel Corporation
InventorsStefan Hau-Riege, Christine Hau-Riege
Life of this patent
Estimating the term…
Abstract
A method is provided for forming a wafer stack. This may include providing a first wafer having a first plurality of metalized trenches on a surface of the first wafer. A second wafer may be provided having a second plurality of metalized trenches on a surface of the second wafer facing the first wafer. The first plurality of metalized trenches may be solder bonded to the second plurality of metalized trenches.
Claims21
A method of forming a wafer stack comprising:
- providing a first wafer having a first plurality of metalized trenches on a surface;
- providing a second wafer having a second plurality of metalized trenches on a surface facing said first wafer;
- and
- solder bonding said first plurality of metalized trenches to said second plurality of metalized trenches.
1 more element
A method of forming a wafer stack comprising:
- applying solder to metalized areas on a first wafer;
- applying solder to metalized areas on a second wafer;
- and
- bonding said metalized areas on said first wafer to metalized areas on said second wafer by heating said solder.
1 more element
A wafer stack comprising:
- a first wafer having a first plurality of metalized trenches on a first surface;
- a second wafer having a second plurality of metalized trenches on a surface of said second wafer;
- and
- a plurality of solder masses each provided between one of said first plurality of metalized trenches and a corresponding one of said second plurality of metalized trenches to electrically connect each of said plurality of metalized trenches with said corresponding one of said second plurality of metalized trenches.
1 more element
Dependencies are inferred from the claim text.