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US 2003/0113954 A1Published application
Method of making a semiconductor package having exposed metal strap
AssigneeAmkor Technology, Inc.
InventorsThomas P. Glenn, Blake A. Gillett
Life of this patent
Estimating the term…
Abstract
Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. The die and at least portions of the strap and substrate are encapsulated in an insulative encapsulant, such as molded plastic. A top surface of the strap is exposed to the environment through the encapsulant. The exposed surface may have grooves formed therein, or fins formed thereon, to facilitate heat transfer.
Claims20
A semiconductor device, comprising:
- a substrate having at least coplanar first and second portions each including one or more leads, wherein each said portion is electrically isolated from each other said portion;
- a semiconductor die having a first terminal electrically connected to a first conductive layer on a first surface of the die, and a second terminal electrically connected to a second conductive layer on an opposite second surface of the die, wherein the first conductive layer faces and is attached to the first portion of the substrate by an electrically conductive material;
- a metal strap having a cover portion at a first end thereof and an opposite second end portion, the cover portion having a first surface and an opposite second surface, wherein the first surface of the cover portion is attached to the second conductive layer of the die with an electrically and thermally conductive material, and the second end portion is attached to the second portion of the substrate with an electrically conductive material;
- and,
- a body of nonconductive encapsulant material encapsulating the semiconductor die and at least a portion of the substrate, wherein the second surface of the cover portion of the metal strap is exposed through the encapsulant material.
2 more elements
A semiconductor device, comprising:
- a substrate having a plurality of leads and a die mounting region;
- a semiconductor die having a plurality of conductive bond pads on an active first surface thereof and an opposite inactive second surface, wherein the second surface is mounted on the die mounting region;
- a plurality of electrical conductors, wherein each conductor is electrically connected between a lead and a bond pad on the first surface of the die;
- a metal strap having a cover portion at a first end thereof and an opposite second end portion, the cover portion having a first surface and an opposite second surface, wherein the first surface of the cover portion is attached to the first surface of the die with a thermally conductive nonelectrically conductive first material, and the second end portion of the strap is attached to one or more leads with a thermally conductive second material;
- and,
- a body of nonconductive encapsulant material encapsulating the semiconductor die and at least a portion of the substrate, wherein the second surface of the cover portion of the strap is exposed through the encapsulant material.
3 more elements
A method for making a semiconductor device, the method comprising:
- providing a substrate having at least coplanar first and second portions each including one or more leads, each said portion being electrically isolated from each other said portion;
- providing a semiconductor die having a first terminal electrically connected to a first conductive layer on a first surface of the die, and a second terminal electrically connected to a second conductive layer on an opposite second surface of the die;
- providing a metal strap having a cover portion at a first end thereof and an opposite second end, wherein said cover portion has a first surface and an opposite second surface;
- mounting the die on the substrate so that the first surface of the die faces the first portion of the substrate;
- attaching both the first conductive layer to the first portion of the substrate and the second end portion of the strap to the second portion of the substrate with an electrically conductive material;
- attaching the second conductive layer of the die to the first surface of the cover portion of the strap with an electrically and thermally conductive material;
- encapsulating the semiconductor die, at least a portion of the substrate, and the metal strap in a body of nonconductive material, while leaving the second surface of the cover portion of the strap exposed.
4 more elements
A method of making a semiconductor device, comprising:
- providing a substrate having a plurality of leads and a die mounting region;
- providing a semiconductor die having a plurality of conductive bond pads on an active first surface thereof and an opposite inactive second surface, wherein the second surface is mounted on the die mounting region;
- providing a plurality of electrical conductors, and electrically connecting each conductor between a lead and a bond pad on the first surface of the die;
- providing a metal strap having a cover portion at a first end thereof and an opposite second end portion, the cover portion having a first surface and an opposite second surface;
- attaching the first surface of the cover portion of the strap to the first surface of the die with a thermally conductive nonelectrically conductive first material, and attaching the second end portion of the strap to one or more leads with a thermally conductive second material;
- and,
- forming a body of nonconductive encapsulant material over the semiconductor die and at least a portion of the substrate, wherein the second surface of the cover portion of the strap is exposed through the encapsulant material.
4 more elements
Dependencies are inferred from the claim text.