Method and apparatus for coupling a semiconductor die to die terminals

A microelectronic device, comprising:

• a support;
• a semiconductor die having at least one terminal, the semiconductor die engaging the support;
• and
• an elongated conductive member having a first end portion and a second end portion opposite the first end portion, the second end portion being proximate the die, the conductive member having an intermediate portion between the first and second end portions, a width of the intermediate portion being less than a width of the second end portion.

A microelectronic device, comprising:

• a die having first and second terminals;
• a first conductive member elongated between a first end portion and a second end portion thereof, the second end portion being proximate to the first terminal of the die;
• and
• a second conductive member elongated between a first end portion and a second end portion thereof, the second conductive member being generally parallel to the first conductive member, the second end portion of the second conductive member being proximate to the second terminal of the die, the second end portion of the second conductive member being offset along the second longitudinal axis from the second end portion of the first conductive member.

A microelectronic device, comprising:

• a die having first and second terminals;
• a first conductive member elongated between a first end portion and a second end portion thereof, the second end portion being proximate to the first terminal of the die, the first conductive member further having a first intermediate portion between the first and second end portions thereof, a width of the first intermediate portion being less than a width of the second end portion;
• a first conductive coupler coupled to and extending between the first terminal of the die and the second end portion of the first conductive member;
• a second conductive member elongated between first and second end portions thereof, the second end portion of the second conductive member being proximate to the second terminal of the die, the second conductive member further having a second intermediate portion between the first and second end portions thereof, a width of the second intermediate portion being less than a width of the second end portion of the second conductive member, the second end portion of the second conductive member being axially offset relative to the second end portion of the first conductive member;
• and
• a second conductive coupler coupled to and extending between the second terminal of the die and the second end portion of the second conductive member.

A microelectronic device, comprising:

• a package having first and second package terminals;
• a semiconductor die positioned within the package and having first and second die terminals;
• a first conductive member having first and second opposite ends and coupled at the first end to the first package terminal;
• a first conductive coupler having first and second opposite ends and coupled at the first end thereof to the first die terminal and coupled at the second end thereof to the second end of the first conductive member;
• a second conductive member having first and second opposite ends and coupled at the first end thereof to the second package terminal;
• and
• a second conductive coupler having first and second opposite ends and coupled at the first end thereof to the second die terminal and coupled at the second end thereof to the second end of the second conductive member, the first conductive member and first conductive coupler being selected to produce a first impedance at the first package terminal and the second conductive member and second conductive coupler being selected to produce a second impedance at the second package terminal, the first impedance being approximately equal to the second impedance.

A microelectronic device, comprising:

• a package having first and second package terminals;
• a semiconductor die positioned within the package and having first and second die terminals;
• a first conductive member having first and second opposite ends and coupled at the first end to the first package terminal;
• a first conductive coupler having first and second opposite ends and coupled at the first end thereof to the first die terminal and coupled at the second end thereof to the second end of the first conductive member;
• a second conductive member having first and second opposite ends and coupled at the first end thereof to the second package terminal;
• and
• a second conductive coupler having first and second opposite ends and coupled at the first end thereof to the second die terminal and coupled at the second end thereof to the second end of the second conductive member, the first conductive member and first conductive coupler being selected to produce a first capacitance and the second conductive member and second conductive coupler being selected to produce a second capacitance, the first capacitance being approximately equal to the second capacitance.

A computer system, comprising:

• a data input device;
• a data output device;
• and
• computing circuitry coupled to the data input and output devices, the computing circuitry including
• a semiconductor die having at least one terminal;
• and
• a conductive member elongated between a first end portion and a second end portion thereof, the second end portion being proximate the terminal of the die, the conductive member having an intermediate portion between the first and second end portions, a width of the intermediate portion being less than a width of the second end portion.

A method for selecting the impedance of a conductive path between a terminal of a semiconductor die and a terminal of a package in which the die is housed, the method comprising:

• selecting a conductive member to have a first impedance;
• selecting a conductive coupler to have a second impedance;
• connecting a first end of the conductive member to the terminal of the package;
• and
• connecting the conductive coupler to extend between the terminal of the die and a second end of the conductive member opposite the first end of the conductive member.

A method for selecting the capacitance of a conductive path between a terminal of a semiconductor die and a terminal of a package in which the die is housed, the method comprising:

• selecting a conductive member to produce a first capacitance;
• selecting a conductive coupler to produce a second capacitance;
• connecting a first end of the conductive member to the terminal of the package;
• and
• connecting the conductive coupler to extend between the terminal of the die and a second end of, the conductive member opposite the first end of the conductive member.